The concept of glass substrate continues to be strong, WOG Optoelectronics hits new historical highs with 5 consecutive limit up in 8 days.
In early trading, the concept of glass substrate continued to be strong, Vogt Optoelectronics broke through 5 boards in 8 days, hitting a new high, Dyer Laser rose by more than 10%, Rainbow shares approached the daily limit, Gobija, Medikai, Lehman Optoelectronics, and Wufang Optoelectronics all saw a rise. On the news front, TSMC stated that it is building a pilot production line for CoPoS packaging technology, and it is estimated that it will enter the mass production stage in a few years. Industry insiders pointed out that TSMC is extending the CoWoS technology route to CoPoS, with the long-term goal of using glass substrates to replace silicon intermediary layers to reduce costs, improve production efficiency, and meet the huge demand of AI chip customers.
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