Northern Huachuang releases 12-inch Qomola HPD30 hybrid bonding equipment.

Beijing Huachuang recently released a 12-inch chip-to-wafer hybrid bonding equipment - Qomola HPD30. This equipment focuses on the extreme requirements of chip interconnection for SoC, HBM, Chiplet and other 3D integrated applications, overcoming core technologies such as high-speed multi-axis linkage control, nanometer-level image recognition, global coordinate precision positioning, multi-specification chip adaptation, real-time AI perception and intelligent compensation. The company has become the first in China to complete the process verification of D2W hybrid bonding equipment client. This release is an important milestone for Beijing Huachuang's entry into the field of 3D integrated hybrid bonding equipment.