Fuda Alloy: Intends to apply to register technology innovation bonds not exceeding 500 million yuan.

Fuda Alloy announced that the 22nd meeting of the seventh board of directors of the company on February 6, 2026 approved a proposal to apply for registration and issuance of technology innovation bonds to the China Interbank Market Dealers Association. The total registration amount shall not exceed 500 million yuan, with a term not exceeding 10 years. The interest rate will be determined according to market conditions. The issuance target is national interbank bond market institutional investors. After deducting issuance expenses, the raised funds will be used for enterprise production and operation. This issuance is subject to further approval by the company's shareholders' meeting and the approval of the Interbank Market Dealers Association. If the issuance is successful, it will broaden financing channels, reduce costs, and support strategic development.