NAURA Technology Group (002371.SZ) plans to acquire 100% equity of Nuohe Jianwei for 405 million yuan.

NAURA Technology Group (002371.SZ) announced that its wholly-owned subsidiary, Beijing NAURA Microelectronics Equipment Co., Ltd. (hereinafter referred to as "NAURA Microelectronics"), signed an Equity Transfer Agreement on October 15, 2026 with Beijing Integrated Circuit Equipment Industry Investment and Acquisition Phase II Fund (Limited Partnership) (hereinafter referred to as "Equipment Phase II Fund"). NAURA Microelectronics intends to acquire, in cash, 100% equity of Beijing Nuohe Jianwei Equipment Co., Ltd. (hereinafter referred to as "Nuohe Jianwei") held by the Equipment Phase II Fund, with a transaction amount of 405 million yuan. In 2025 and the first half of 2026, Nuohe Jianwei's operating profit and net profit were negative, mainly because its core product, hybrid bonding equipment, is still in the stages of technological iteration, product validation, and market introduction, resulting in a relatively small revenue scale and large R&D investment. Hybrid bonding is a key process for achieving ultra-high-density interconnection, and hybrid bonding equipment is key equipment supporting the core process of advanced packaging, widely used in 3D integration fields such as SoC, HBM, and Chiplet. Nuohe Jianwei has formed key technology reserves in core aspects of hybrid bonding equipment, including optical alignment, compensation algorithms, mechanical motion control, precision vibration control, and bonding head design. Its shipped equipment has achieved nanoscale precision alignment, its products have obtained repeat orders, and it is cooperating with several other leading customers on equipment validation and negotiations for intended orders, demonstrating strong market competitiveness and good development prospects. After the acquisition is completed, Nuohe Jianwei will be included in the company's consolidated financial statements. The businesses of both parties are complementary. This acquisition is conducive to leveraging synergies, significantly enhancing the company's market competitiveness in hybrid bonding equipment and full-process equipment platforms for 3D integration, efficiently matching industry development needs, and better serving customers.