HK Stock Market Move | Circuit Fabology Microelectronics Equipment (09630) rose over 6%. The company's phase II production capacity will enter a full release stage in the second half of the year, and order backlog for its full range of equipment is substantial.
Circuit Fabology Microelectronics Equipment (09630) rose over 6%. As of press time, it was up 6.33%, at HK$366.4, with a turnover of HK$49.4876 million.
Circuit Fabology Microelectronics Equipment (09630) rose over 6%, up 6.33% as of press time, at HK$366.4, with a turnover of HK$49.4876 million.
On the news front, on September 14, Cheng Zhuo, Chairman of Circuit Fabology Microelectronics Equipment, said at the 2026 interim results meeting that looking ahead to the second half of the year, order deliveries for high-end PCB equipment remain full, and advanced packaging equipment has also entered the verification and implementation stage; next year, AI servers, related substrates, and advanced packaging capacity expansion will still bring equipment increments. The company's phase II plant was in the ramp-up stage in the first half of the year, with overall capacity utilization maintained at a high level. For the full year, phase II production capacity will enter a full release stage in the second half, and relying on modular production and advance stocking of core components, the company will continue to take on high-end PCB and advanced packaging equipment orders.
Shanghai Securities pointed out that the phase II base, which was put into production in 2025Q3, entered the capacity ramp-up stage in 2026H1, with total designed capacity reaching more than twice that of phase I, effectively alleviating the bottleneck of overcapacity, while full-cycle capacity utilization remained high in the first half of the year. The company's order backlog for its full range of equipment is substantial, with newly signed orders in the first quarter of 2026 exceeding RMB 800 million, and the second quarter continuing the high-level trend, among which orders for pan-semiconductor advanced packaging and high-end IC substrate equipment grew rapidly, with the product mix continuing to optimize toward high-value, high-margin models.
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