Huaqin Co., Ltd. (03296) issued 1.2 billion yuan in corporate bonds.
Huaqin Technology (03296) announces that the public offering of the Huaqin Technology Co., Ltd.'s 2026 Technology Innovation Corporate Bonds (Series 2) targeted at professional investors ended on May 6, 2026. The actual issuance size of this bond (bond abbreviated as: 26 Huaqin K2, code: 245153.SH) is 1.2 billion RMB, with a final coupon rate of 1.80%.
Huaqin Co., Ltd. (03296) announced that the issuance of the Technology Innovation Corporate Bonds (Second Tranche) for professional investors in 2026 by Huaqin Co., Ltd. has ended on May 6, 2026. The actual issuance size of this bond (bond name: 26 Huaqin K2, code: 245153.SH) is 1.2 billion RMB, with a final coupon rate of 1.80%.
Related Articles

Shenzhen Gongjin Electronics (603118.SH) plans to increase capital of 50 million yuan to Beijing Hongguangxiang Technology Co., Ltd.

HUADIAN POWER (01071) will distribute a final dividend of 0.14 yuan per share on July 28th.

PATEO (02889) has completed the issuance of 895,980 shares of subscribed shares.
Shenzhen Gongjin Electronics (603118.SH) plans to increase capital of 50 million yuan to Beijing Hongguangxiang Technology Co., Ltd.

HUADIAN POWER (01071) will distribute a final dividend of 0.14 yuan per share on July 28th.

PATEO (02889) has completed the issuance of 895,980 shares of subscribed shares.






