Shenzhen Tongye Technology (300960.SZ) intends to acquire 91.69% equity of Silink Technology for 561 million yuan to enhance product competitiveness.

Shenzhen Tongye Technology (300960.SZ) announced that the company had previously intended to acquire 100% of the equity of Silink Technology. After multiple communications and negotiations between the company and the counterparty, as well as considering the final intentions of relevant parties, it was decided to adjust the acquisition ratio of this major asset restructuring from 100% to 91.69%. On December 26, 2025, the company signed the "Equity Acquisition Agreement of Beijing Silink Semiconductor Technology Co., Ltd." with 22 counterparties including Huang Qiang, Gongqingcheng Silink Huode Investment Partnership Enterprise (Limited Partnership), Gongqingcheng Silink Innovation Investment Partnership Enterprise (Limited Partnership), Wenzhi, Gongqingcheng Silink Zhihui Investment Partnership Enterprise (Limited Partnership), and Wensheng. The company plans to purchase 91.69% equity of Silink. After the transaction is completed, the company will hold 91.69% equity of Silink, making Silink a subsidiary of the company. The transaction price for the 91.69% equity of the target company is 561 million yuan. In this transaction, in addition to acquiring 91.69% of Silink's equity, the company plans to transfer 6.00% of the shares of the listed company held by the controlling shareholders of the listed company, Xie Wei and Xu Jianying, and their concerted action person Tianjin Nvidia Entrepreneurship Investment Partnership Enterprise (Limited Partnership) (referred to as "Tianjin Nvidia") to Gongqingcheng Silink Enterprise Management Investment Partnership Enterprise (Limited Partnership) controlled by the actual controller of Silink, Huang Qiang. The announcement shows that Silink's main business is the research, design, and sales of communication chips and related products for the power Internet of Things. Its main products include electric power high-speed power line carrier (HPLC) communication chips and modules, and electric power high-speed dual-mode (HDC) communication chips and modules. After the transaction is completed, on one hand, Shenzhen Tongye Technology can use its advantages in the rail transit market to apply the high-speed power line carrier chips and modules to rail transit power grid systems, signal systems, and freight vehicle communication systems, extending the market application scope in the industry; on the other hand, the company can optimize the original rail transit locomotive and vehicle electrical products through high-speed power line carrier and dual-mode communication technology, enhancing the core competitiveness of the products.