HK Stock Market Move | SICC Co., Ltd. (02631) rises over 5%, included in the Hong Kong Stock Connect, silicon carbide expected to welcome new market volume.

SICC Co., Ltd. (02631) rose more than 5%, as of the time of publication, rising by 5.17% to HK$62 with a trading volume of HK$270 million. On the news front, the Shanghai and Shenzhen Stock Exchanges announced that SICC Co., Ltd. will be included in the list of securities eligible for trading through the Stock Connect as the stabilization period in the Hong Kong market for the company has ended and its A-shares have been listed for more than 10 trading days, with the change taking effect on September 15. Additionally, recent reports stated that NVIDIA plans to switch the intermediate substrate material in the CoWoS advanced packaging stage of the next-generation Rubin processor from silicon to silicon carbide to improve performance. Orient believes that due to the excellent thermal conductivity of silicon carbide crystal, it has potential applications in environments with higher heat dissipation requirements, such as in intermediate layers and heat dissipation substrates, benefiting related manufacturers. It is recommended to pay attention to SICC Co., Ltd. SICC Co., Ltd. recently stated on its interactive platform that the company's silicon carbide substrate can be widely used in downstream products such as power semiconductor devices, RF semiconductor devices, optical waveguides, TF-SAW filters, and heat dissipation components. The main application industries include electric vehicles, photovoltaics and energy storage systems, electric power grids, rail transportation, communications, AI glasses, smartphones, and semiconductor lasers. The company's silicon carbide substrate, when processed by customers, is used to make power electronic devices, which are ultimately applied in a variety of terminal products in fields such as electric vehicles, AI data centers, and photovoltaic systems.