The China Securities Regulatory Commission has approved the IPO registration of Tongyu New Material on the Shenzhen Stock Exchange ChiNext board.

On April 25th, the China Securities Regulatory Commission announced the approval of the initial public offering of shares of Tongyu New Materials (Guangdong) Co., Ltd. It is reported that Tongyu New Materials plans to be listed on the ChiNext board of the Shenzhen Stock Exchange, with Industrial acting as the sponsor institution, aiming to raise 1.3 billion yuan. The prospectus shows that Tongyu New Materials' main business is the research, production, and sales of electronic resins, mainly used in the production of copper-clad laminates. The company's products mainly include MDI-modified epoxy resin, DOPO-modified epoxy resin, high-bromine epoxy resin, BPA-type phenol-formaldehyde epoxy resin, and phosphorus-containing phenol-formaldehyde resin curing agents. The company has independently designed and developed benzoxazine resins with a skeleton structure containing double bonds, which have already passed customer testing and begun small-scale supply, providing cost-effective solutions for domestic high-speed copper-clad laminates with Low Loss levels. The company's main products have been certified by downstream well-known copper-clad laminate manufacturers such as KINGBOARD HLDG, Shengyi Technology, Nanya New Material Technology, Zhejiang Wazam New Materials, Jinbao Electronics, and Guangdong Goworld.