The chip department of a large car factory.

In the current deep transformation of the global automotive industry towards electrification, intelligence, and networking, chips have become the core driving force of this transformation. According to statistics from the China Association of Automobile Manufacturers, the number of chips required for a car has increased from 600-700 chips per traditional fuel vehicle to 1600 chips per electric vehicle, with the demand for chips for more advanced intelligent vehicles expected to increase to 3000 chips. This includes various types of chips, such as MCU chips for controlling power transmission, AI chips for providing strong computational support for intelligent driving, and cabin chips for creating an immersive cabin experience, serving as the "brain" and "central nervous system" of the car, controlling all key commands and data processing. It is estimated that by 2030, the proportion of automotive electronics in the total cost of a car will reach 50%, and the global annual demand for automotive chips is expected to exceed 160 billion, highlighting its importance. Looking back, the global automotive industry has faced a shortage of chips in the past, which swept through the entire industry and had a significant impact on major car manufacturers. At the same time, this chip shortage also exposed the fragility of China's automotive industry supply chain. In the critical field of chips, foreign suppliers still dominate, with international chip giants controlling the high-end chip market. The stability and autonomy of the supply chain have become a hanging sword for the development of Chinese car companies, underscoring the importance of autonomous and controllable supply chains. As a result, many domestic car companies have learned from their past experiences and are striving to break through in order to take control of the situation. They have embarked on the journey of "making chips", and a technological competition centered around chips has quietly begun in the automotive field. The wave of car companies "making chips" is surging. BYD Company Limited: Layout of chips in multiple fields BYD Company Limited, as a leader in the field of new energy vehicles, has also been a pioneer in the self-developed chip industry. As early as the end of the last century, when BYD Company Limited entered the battery business, it keenly recognized the critical role of chips and quietly launched the journey of automotive chip development. Around 2003, BYD Company Limited established its microelectronics division, entering the field of integrated circuits and power device development, laying the foundation for its chip business. In 2008, BYD Company Limited invested nearly 200 million to acquire Ningbo Zhongwei Semiconductor. Despite continuous external skepticism at the time, this move laid a solid foundation for its chip development. Since then, BYD Company Limited has continued to deepen its efforts. In 2010, it successfully launched the 1.0 generation IGBT chip, achieving a breakthrough from scratch; in 2013, the 2.0 generation chip was installed, opening a new chapter in chip application; in 2018, the brand-new 4.0 generation IGBT chip for vehicles was released, with technical indicators reaching international advanced levels, marking a significant leap for domestically produced IGBT chips. Today, BYD Company Limited's IGBT chips not only meet its own needs but also supply them to other domestic car companies, breaking foreign monopolies, significantly reducing costs, and enhancing the core competitiveness of China's automotive industry. In 2020, BYD Company Limited's microelectronics division was reorganized as BYD Semiconductor Co., Ltd., ranking second in sales of IGBT modules for passenger car motor drive controllers in China. Now, BYD Semiconductor has established a full industry chain IDM model covering chip design, wafer manufacturing, packaging testing, and downstream applications. It has become a leading domestic manufacturer of vehicle-grade IGBTs, with its IGBT modules not only meeting its own needs but also supplying them to external car companies, breaking foreign monopolies. In terms of vehicle-grade MCU chips, BYD Company Limited mass-produced 8-bit MCU chips in 2018, achieved a technological upgrade to 32-bit MCU chips in 2019, becoming China's largest manufacturer of vehicle-grade MCU chips. In 2020, it launched the world's first three-phase full-bridge SiC module for electric motor drives, applied to high-end models of new energy vehicles. In the field of intelligent driving and cabin chips, BYD Company Limited has been following closely and making full efforts. On the one hand, cooperating with Horizon and NVIDIA to introduce advanced chips to enhance intelligent driving capabilities; on the other hand, its self-developed 80TOPS computational power intelligent driving dedicated chip has made a major breakthrough, strengthening the overall level of intelligent integration of vehicles. It is worth noting that BYD Company Limited plans to gradually switch all OrinN and Horizon J6E chips to its self-developed 80TOPS computational power chips in the future, achieving autonomous and controllable hardware for intelligent driving. At the same time, the addition of Liu Yi, former head of parking control business at Xiaopeng Motors, has injected new energy into BYD Company Limited's self-developed intelligent driving control business, helping BYD Company Limited to quickly iterate and upgrade in the field of intelligent driving and build a more complete intelligent driving ecosystem. In terms of intelligent cabin chips, BYD Company Limited Semiconductor has recently launched its self-developed 4nm process BYD 9000 chip, based on the Arm v9 architecture, with built-in 5G baseband, bringing smooth interactive experience and high-speed network connectivity to intelligent cabins. This demonstrates BYD Company Limited's strong capabilities and comprehensive layout in the multi-field development of chips, marching full speed towards an intelligent future. Geely [00175]: Successful Launch of "Dragon Eagle No. 1" On the road to breakthroughs in domestic automotive chips, Geely's subsidiary ZQ Tech developed the first domestically-produced vehicle-grade 7nm intelligent cabin chip "Dragon Eagle"."One", has become the focus of industry attention.According to reports, this chip integrates 88 billion transistors, uses a 7nm advanced process, has an 8-core CPU, 14-core GPU, and AI computing power twice that of the Qualcomm Snapdragon 8155, supports 2.5K HD video playback, and has advanced AI capabilities that can be continuously expanded. Its processing power and multimedia presentation capabilities are at the industry's top level. With the mass production of the "Dragon Eagle 1," a breakthrough has been achieved in the field of high-end intelligent cockpits in cars using domestically produced chips. It is expected that the shipment volume will reach a million units in 2024, breaking the monopoly of foreign chips in this field. In addition, Chips Technology has also launched a new generation of high-end SoC chip AD1000 for smart driving, with single chip support for L2++ assisted driving capabilities, two chips combining for 512TOPS computing power to meet the computing requirements for L3 smart driving, and four chips combining for 1024TOPS computing power to support level L4 autonomous driving. It can be seen that the AD1000 matches the current mainstream smart driving chip Nvidia Orin-X in terms of performance indicators. However, the official mass production and commercial release of this chip have not been announced. Following the success of the "Dragon Eagle 1," Chips Technology continued to push forward and launched the all-scenario high-end autonomous driving chip "Star 1" in October 2024. It is reported that this chip uses a 7nm automotive-grade process, complies with the AEC-Q100 standard, and its multi-core heterogeneous architecture makes intelligent driving computing power stronger: the CPU computing power reaches 250 KDMIPS, the NPU computing power reaches 512 TOPS, and through multi-chip coordination, it can achieve a maximum of 2048 TOPS computing power. In terms of hardware configuration, the AD1000 integrates high-performance VACC and ISP, has an integrated ASIL-D functional safety island, rich interfaces, supports up to 20 high-resolution cameras, and multiple sets of lidar, cameras, and mm-wave radar, supports sensor fusion front and back, and can fully meet the requirements of L2 to L4 intelligent driving. "Star 1" directly competes with the most advanced international smart driving products, and surpasses them in key indicators such as CPU performance, AI computing power, ISP processing capability, and NPU local storage capacity. It is reported that this chip will be mass-produced in 2025 and will be widely used in 2026. With the mass production of "Star 1" in the future, Geely will continue to deepen its layout in the field of autonomous driving. From adaptive cruise control in city congestion to automatic lane changing at high speeds, and exploring higher-level autonomous driving scenarios in the future, "Star 1" will inject powerful intelligent driving force into GEELY AUTO, helping it sprint forward in the field of autonomous driving and consolidate Geely's leading position in the development of domestically produced car chips. Great Wall Motor: Creating the First Domestic RISC-V Open-source Architecture Automotive Grade Chip In the fierce competition in the automotive chip industry, Great Wall Motor has taken a different approach. Since the "chip shortage" in 2021, they have invested in the development of an open-source RISC-V architecture chip. After 12 months of hard work, on September 20, 2024, the first domestic automotive-grade MCU chip based on the open-source RISC-V core designed - the Zijing M100, successfully lit up, marking an important milestone in the development of domestic automotive chips in China. The Zijing M100, nurtured by Great Wall Motor and developed in collaboration with the Zijing Semiconductor team, is the first star product designed based on the open-source RISC-V core in China. The Zijing M100 has a high degree of localization, with a self-researched IP rate exceeding 80%, reaching a level of self-reliance. It adopts a modular design, with a reconfigurable core, a 4-tier pipeline design, and a CoreMark reaching 2.42, providing a 38% performance improvement compared to competing products, making the machine respond faster and with less latency, for easier future upgrades and expansions. At the same time, the Zijing M100 meets the requirements of functional safety ASIL-B level, supports national encryption algorithms, and complies with ISO 21434 network security standards. The significance of this chip breakthrough is extraordinary. Technologically, it breaks the monopoly of mainstream international architectures, opening up a new path for self-developed domestic chips; in the industry, it promotes the research progress of RISC-V and accelerates the localization replacement of chips. Great Wall Motor's chip layout extends beyond technological breakthroughs to focus on on-board applications and ecosystem construction. The Zijing M100 chip is designed for body control, capable of handling at least 9 systems such as combination lamps, ambient lighting, air compressor, wireless charging, etc., and it can meet the differentiated requirements of different vehicle models and architectures, making it very flexible for on-the-ground applications. It is already widely used in multiple vehicle models, with plans to reach a volume of no less than 2.5 million units in the next five years. At the same time, Great Wall Motor, with the Zijing M100 as the core, continues to deepen its presence in the chip field, planning for the next generation of high-performance chips for power, chassis, and domain control applications, with higher functional safety levels and higher performance, including vehicle control units, drive chips, power management chips, and AFE analog front-end chips. They are devoted to building a comprehensive smart automotive industry chain ecosystem. Overall, from precise control of intelligent driving to comfortable interaction in the smart cockpit, and efficient vehicle control, Great Wall Motor's self-developed chips will provide comprehensive empowerment, improve user experience, promote the intelligent transformation of the Chinese automotive industry, and steadily move towards the goal of independent and leading-edge chip technology. In fact, as a leader in the Chinese automotive brand, Great Wall Motor established the ChiDong Semiconductor in 2022, focusing on the development of chips in areas such as IGBT, SiC MOS, intelligent driving, and smart cockpits, with a focus on comprehensive chip design and module testing through the entire industry chain. Dongfeng Motors: Introduction of Automotive Grade MCU As early as 2019, Dongfeng Motors partnered with its subsidiary Zhixin Technology and Zhuzhou CRRC Times Electric to establish Zhixin Semiconductor through a joint venture, starting the construction of a power semiconductor module packaging testing production line in the Dongfeng New Energy Automotive Industry Park. After a arduous journey, efforts have paid off. Dongfeng Motors announced the unveiling of an automotive-grade MCU chip developed by Zhixin Semiconductor at the Dongfeng New Energy Technology Innovation Summit held in Wuhan. The MCUs is based on the embedded RISC-V architecture and is the first product in China to apply the automotive grade manufacturing process. Dongfeng Motors powered by the scenes that at least nine sub-systems like combined lighting, ambient lighting, air compressor, and wireless charging, and its adaptability across a range of vehicle models and architectures makes it significantly flexible in practical applications. Dongfeng Motors aims for applied in no less than 250.000 vehicles within the next five years.Research and development, independently manufactured and sold power semiconductor modules officially entered mass production in July 2021. The first automotive grade IGBT module product slowly drove out of the Zhi Xin Semiconductor Module Packaging Factory, marking a major breakthrough for Dongfeng in successfully achieving domestic substitution of automotive grade chip modules.and more importantly, Dongfeng Motor continuously expands its layout in the semiconductor field. In 2024, the Wuxi Huaxin Semiconductor partnership was established, with Dongfeng Asset Management Ltd., a wholly-owned subsidiary of Dongfeng Motor Group, holding a 15.23% stake as the second largest shareholder. This investment demonstrates Dongfeng's determination to deepen its semiconductor layout, integrate resources with capital power, leverage various advantages, accelerate semiconductor technology research and development, and industrial implementation from chip design, manufacturing, packaging testing to create synergies throughout the entire industry chain, laying a solid foundation for Dongfeng Motor's smart and electrified transformation. At the same time, Dongfeng Motor is well aware of the power of industrial collaboration and innovation. In May 2024, led by Dongfeng Motor Group, a joint effort was made with 9 companies, universities, and research institutions including Wuhan Feithin Microelectronics Technology Co., Ltd., Wuhan Lingdi Auto Electronic Control System Co., Ltd., Wuhan University of Technology, and Huazhong University of Science and Technology, to establish the Hubei Province Automotive Grade Chip Industry Technology Innovation Alliance. This alliance aims to meet the national demand and international frontier of automotive chip industry, pool political, production, academic, and research efforts to realize the localization of automotive grade chip independent definition, design, manufacturing, sealing, testing, and controller development. On November 9th, the Hubei Province Automotive Grade Chip Industry Technology Innovation Alliance, led by Dongfeng Motor, released a high-performance automotive grade MCU chip - DF30. The DF30 chip is the industry's first high-end automotive grade MCU chip based on independent open-source RISC-V multicore architecture, developed in a domestic 40nm automotive grade process, fully domestically closed-loop, with a functional safety level reaching ASIL-D. It can be widely used in power control, vehicle body and chassis, electronic information, driving assistance, and other areas, compatible with the domestic self-developed AutoSAR automotive software system, filling the domestic gap. As of now, the DF30 chip has entered the control system application development stage and is expected to be the first to be mass-produced and onboarded. Dongfeng Motors and China's SiKong jointly invested 1 billion yuan to establish Wuhan Binary Semiconductor Co., Ltd. to lay a solid foundation for chip localization manufacturing. As of now, Dongfeng has completed the flow of three automotive grade chips. In addition to the DF30 MCU chip, the H-bridge drive chip has achieved second flow, the high-side drive chip has started mass production and carrying on vehicles, and has passed the highest certification of functional safety system in the industry. With a scale of millions of automotive chip needs as guidance, Dongfeng Motor is committed to achieving a 60% localization rate of automotive grade chips by 2025, and aims to challenge a goal of 80%, injecting strong momentum into the localization of automotive chips. In the future, Dongfeng Motor will continue to increase research and development, nurture talents, improve chip research and development and industrialization levels, promote high-quality development of China's automobile industry, and move forward towards a future of controllable independent chips. NIO (09866): Launching 5nm High-end Autonomous Driving Chip In the field of autonomous driving chips, NIO Motors, with its profound technical accumulation and innovative spirit, has made significant breakthroughs. In July of this year, NIO released the 5nm autonomous driving chip - Shenji NX9031, at the NIO IN 2024 NIO Technology Innovation Day, attracting industry attention. It is understood that this chip adopts the industry-leading 5nm vehicle grade process, with a single chip transistor reaching 500 billion+, integrating a 32-core super CPU architecture for parallel processing of massive real-time tasks; self-developed image signal processor ISP for faster and clearer image recognition; various inference acceleration units NPU for efficient operation of various AI algorithms; milliwatt power control, wake-up on demand, LPDDR5X rate of 8533Mbps; top-level native security design, dual-chip millisecond backup ability to achieve the highest level of security assurance. Li Bin proudly announced that Shenji NX9031 truly achieves the performance of four flagship chips in the industry with a single chip. Furthermore, in parallel, NIO also released the SkyOS Tianxiu, a vehicle-wide operating system, in conjunction with the Shenji NX9031 chip. SkyOS Tianxiu features high bandwidth, low latency, large computing power, heterogeneous hardware, cross-domain integration, etc., opening up intelligent hardware, computing platforms, communication and energy systems at the bottom layer, and achieving unified management and coordination of all-round applications such as vehicle networking, vehicle control, intelligent driving, digital cockpit, and mobile applications. It is reported that the first NIO ET9 equipped with the Shenji NX9031 chip will be unveiled in the first quarter of next year. At that time, NIO will bring users an unprecedented intelligent driving experience with this "golden combination" of chip and operating system. The launch of Shenji NX9031 has enabled NIO to take big steps forward in the development of intelligent driving technology, relying on its powerful computing power to continuously optimize intelligent driving algorithms, and provide users with safer, more convenient, and comfortable travel experiences, consolidating NIO's leading position in the high-end intelligent electric vehicle field. From the perspective of research and development history, as a leader among the new forces, NIO's exploration in the field of intelligent driving chips has never stopped. In the early stages, NIO cooperated deeply with Mobileye, utilizing its mature technology to quickly build intelligent driving basic infrastructure, and the intelligent driving assistance systems installed in models such as the ES6 demonstrated their capabilities, bringing users an experience beyond traditional driving. However, as intelligent driving advances to higher levels, the requirements for chip computing power and perception accuracy have increased exponentially, and the limitations of general solutions have gradually become evident. Therefore, NIO resolutely embarked on the path of self-developed chips, starting to build a chip team in the second half of 2020, which has now grown to over 800 people, and after years of intensive research, they have finally achieved success. The successful flow of chips is of great significance, marking the beginning of the mass production process. XPeng (09868): Benchmarking Orin X, One Chip Can Replace Three Chips In the field of intelligent driving, XPeng Motors has always been a pioneer explorer, and its path of self-developed chips is precise and focused, targeting the core requirements of L4 level autonomous driving. In August 2024, XPeng successfully flowed the self-developed Turing chip, instantly becoming the focus of the industry. It is reported that the Turing chip is equipped with luxurious configurations, 40-core processor paired with 2 x NPU, capable of running up to 30 billion parameters large models, providing strong computing power support for intelligent driving algorithms. What's unique is that it is equipped with 2 independent ISPs, which can accurately capture image details in complex lighting environments such as night, rain, backlit, ensuring precise and stable visual perception of the intelligent driving system. A single chip can achieve L3+ advanced intelligent driving experience, replacing three chips.The combination of dual chips can help vehicles achieve Level 4 fully autonomous driving, claiming to be able to drive as many functions as three chips with NVIDIA Orin X. It can drive both automatic driving and intelligent cockpit large models, known as "one chip tops three chips".it is speculated that the chip may be an "integrated cockpit" chip, with a manufacturing process of 5nm or 4nm, and the AI computing power density is expected to be between 500TOPS and 750TOPS. This chip is tailored for L4 autonomous driving, making it the world's first AI chip applied in AI cars, Siasun Robot & Automation, and flying cars, showcasing Xiao Peng's deep insight into future diversified travel scenarios. Ideals (02015): Chip-making plan will reach a critical point After NIO launched the "Nio" smart driving chip, Xiao Peng exposed the "Turing" smart driving chip, Ideals also entered the game. After firmly establishing its foothold in the new energy vehicle market with precise product positioning, Ideals quickly immersed itself in the wave of self-developed chips and initiated a in-depth technical revolution. Starting in November 2023, Ideals accelerated the development of its self-developed intelligent driving SoC chip, quietly expanding its chip development team to about 200 people, gathering industry talents, and fully tackling key chip technologies. According to industry sources, Ideals' first intelligent driving SoC chip is named "Shumacher". The research and development team is optimizing the chip architecture, delving into Chiplet and RISC-V technologies, and aiming to break through performance bottlenecks. Recently, news came out that Ideals' self-developed smart driving chip has begun mass production. At the same time, Ideals has also posted recruitment information on various platforms, recruiting strategic investors related to chips and training cluster in Hong Kong, and establishing a dedicated chip research office in Hong Kong. Compared to NIO and Xiao Peng, Ideals is slightly slower in the progress of self-developed smart driving chips and will rely more on cooperative suppliers. It is reported that Ideals' self-developed smart driving chip includes the front-end design of the inference model acceleration unit NPU, while the back-end design will be outsourced to Taiwan's Worldchip Electronics and manufactured by TSMC. Although there is no physical chip yet, based on the information revealed by Ideals, this chip is expected to benchmark or even surpass large computing products like NVIDIA's platform, aiming for at least two to three hundred TOPS of computing power to provide solid support for advanced intelligent driving. The first chip is expected to reach a critical point this year. By then, Ideals will hopefully further improve the intelligent driving experience with its self-developed chip, surpassing competitors in the smart car competition track, and bravely advancing towards technological independence and self-improvement. In addition, Ideals Motors and Sanan Optoelectronics jointly invested to establish Suzhou Sico Semiconductor Co., Ltd., focusing on the research and production of third-generation silicon carbide semiconductor chip modules to provide core component support for Ideals Motors' products. Overall, with Ideals Motor's deep layout and exploration in self-developed chips, it is expected to occupy a place in the future smart driving chip market and jointly rewrite the industry landscape with new forces like NIO and Xiao Peng. SAIC (600104.SH): Striving for domestic chip proportion to reach 30% Among the top domestic car companies' "chip-making" landscape, SAIC Motor Corporation's layout is strategically astute. On one hand, relying on close cooperation with chip companies like Horizon, SAIC continues to expand the application of intelligent driving chips in a variety of models, significantly enhancing intelligent driving performance. On the other hand, SAIC's Innovation and R&D Institute is actively taking action, with nearly 10 new domestic chip mass production vehicle projects planned for 2024, covering various key chip types to further enhance the domestic chip production rate in the automotive industry. Currently, SAIC Motor Corporation plans to increase the proportion of domestic chips to 30% by 2025, and plans to complete the validation of 100 domestic chip vehicle projects within the year. It has established a dedicated task force to build a domestic chip vehicle validation platform and is participating in chip companies to drive the development and application of automotive chip technology, accelerating the improvement of the level of self-developed automotive-grade chips to further ensure the security of the industrial supply chain. BAIC: Diversified chip layout BAIC Group's chip layout is diverse and deep. On one hand, in close collaboration with semiconductor companies, such as its subsidiary BAIC Production Investment's joint venture with Imagination to establish Nuclear Core Company, which is dedicated to the research and development of autonomous driving application processors and intelligent cockpit voice interaction chips. Leveraging Imagination's IP platform advantages and BAIC's whole vehicle eco advantages, the intelligent cockpit chip injects "smart core" into BAIC's new energy vehicles. In addition, BAIC has also invested in companies like Feizeng Semiconductors and Guangdong Xijuneng Semiconductors to ensure the supply of key chips such as SiC power devices and IGBT, strengthening new energy vehicle power and energy management. Through the dual drive of independent research and development and strategic cooperation, BAIC Group is continuously improving the self-sufficiency rate of new energy vehicle chips, significantly enhancing product performance and intelligence level, and moving full speed ahead towards a green and intelligent future, aiming to achieve more brilliance in the field of new energy vehicle chips and lead the industry's reform trend. In addition, compared to new energy vehicle companies' preference for self-developed chips, traditional car companies like SAIC and BAIC, as well as GAC and FAW, tend to participate in the chip industry through joint ventures or strategic investments, increasing their presence in the automotive chip sector. Automotive chip making comes with opportunities and challenges Looking back on the development process, top domestic car companies have overcome many challenges in the journey of self-developed chips, achieving a series of successes. BYD Company Limited's IGBT chip and intelligent cockpit chips, Geely's "Dragon Eagle I", Great Wall's ZiJing M100, SAIC's localization efforts, GAC's multi-dimensional layout, BAIC's collaborative achievements, Dongfeng's breakthroughs in academia and industry, as well as the pioneering efforts of new forces like NIO, Xiao Peng, Ideals, all demonstrate Chinese car companies' determination and strong capabilities to break free from chip constraints and take control of their own destinies. The significance of self-developed chips for car companies is extraordinary. On one hand, the stability of the supply chain is greatly improved, the dilemma of "chip shortage" is alleviated, and production is no longer restricted by external supply fluctuations. On the other hand, cost control is more precise, breaking away from the cost pressure of purchasing expensive chips, and achieving cost reduction and efficiency increase through the scale effect of self-developed chips. More importantly, self-developed chips create a technological differentiation "moat" for car companies, based on their product positioning and technology roadmap.Customized chips, deeply optimized functions such as intelligent driving and smart cockpit, product competitiveness and brand recognition skyrocket.At the same time, the wave of self-developed chips by automakers will also trigger a chain reaction in the automotive industry ecosystem. Upstream, closely linked with chip raw material suppliers to ensure stable supply of high-end materials such as silicon wafers and photoresist, with excellent quality; deep cooperation with wafer foundries to optimize production processes and improve chip yield. In response to the demand from automakers, the domestic foundries' chip manufacturing process is becoming increasingly mature. In the middle, universities and research institutions are the source of innovation, and automakers are establishing joint laboratories to inject cutting-edge theories into chip R&D; companies are joining forces, with chip companies and automakers collaborating on R&D to achieve technology sharing and risk sharing. In this wave of localization of automotive chips, domestic automakers have taken solid steps and achieved many results, but the road ahead is still full of challenges. On the technical front, high-end chip design and manufacturing processes remain the key challenges for Chinese automakers. The design of chips itself is an extremely complex system engineering, from architecture selection to logic design, circuit layout to signal transmission, each step requires profound professional knowledge and rich practical experience. For example, in the case of autonomous driving chips, handling massive road condition data, real-time complex algorithm computations, and high requirements for computing power and data processing speed, the design difficulty grows exponentially. Compared to international chip giants, there is still a significant gap in key areas such as advanced processes and high-performance computing chip development. Some high-end chips internationally have already adopted 3nm or even more advanced processes, while most self-developed chip processes by Chinese automakers are relatively behind, which to some extent limits chip performance and makes it difficult to meet the future intelligent vehicle's ultimate pursuit of ultra-high computing power and ultra-low power consumption. In addition, the development of automotive-grade chips needs to consider extreme environmental adaptability, high reliability, and other special requirements, which exponentially increase the difficulty of development, making technological accumulation and experience indispensable. From a financial perspective, chip development is a bottomless money pit. From initial design, tape-out to testing, mass capital injection is required in every step, and the R&D cycle is long with uncertain returns. For automakers, continuous massive investment in R&D undoubtedly puts immense pressure on the company's financial chain, especially in the current context of the fiercely competitive new energy vehicle market and the challenging profitability situation for automakers. The financial difficulties become more prominent, and balancing R&D investment with the financial health of the company becomes a major test. Talent shortage is also a key factor limiting automakers' chip manufacturing efforts. The chip industry spans multiple disciplines, requiring talents with deep professional knowledge in areas such as semiconductor physics, integrated circuit design, algorithms, and other cutting-edge disciplines. Currently, there is a shortage of chip talents in China, especially high-end, versatile talents. To attract talent, automakers have to offer high salaries, leading to a surge in labor costs. At the same time, the connection between talent cultivation in universities and industry demand is not close enough, making it impossible to provide a large number of matching talents to the industry in the short term. In conclusion, In this battle to break through in automotive chips, OEMs, suppliers, governments, universities, and research institutions each play their role, closely cooperating and gathering vast power. From the joint R&D of chips, technical research, to the construction of the industry ecosystem, and talent cultivation and delivery, each part demonstrates the value of cooperation. Looking ahead, the road for automakers to manufacture chips is full of challenges, but it also holds infinite opportunities. With the full integration of resources from all parties, the continuous breakthrough and application of domestic chip technology, the Chinese automotive industry will gradually reduce its reliance on imported chips, enhancing the competitiveness and voice of the Chinese automotive chip industry globally.