Kuo Ming-chi: Apple Inc.'s (AAPL.US) M5 chip set to enter mass production as early as the first half of next year, adopting Taiwan Semiconductor Manufacturing Co., Ltd.'s (TSMC) N3P process technology.

On December 23rd, Tianfeng International analyst Guo Mingxi posted on social platform X that Apple Inc. (AAPL.US) M5 series chips will adopt Taiwan Semiconductor Manufacturing Co., Ltd. Sponsored ADRN3P process, with prototypes entering production several months ago. It is expected that the M5, M5 Pro/Max, and M5 Ultra will be mass-produced in 1H25, 2H25, and 2026 respectively. Guo Mingxi pointed out that the M5 Pro, Max, and Ultra will use server-grade SoIC packaging. In order to improve production yield and heat dissipation efficiency, Apple will use a 2.5D packaging called SoIC-mH (molding horizontal), combined with a design that separates the CPU and GPU. He continued to mention that Apple's PCC infrastructure construction will accelerate after the production of high-end M5 chips, as they are more suitable for AI inference.