Alibaba's T-Head reportedly plans Hong Kong IPO in 2027, no official response yet

According to foreign media reports, T-Head, Alibaba's semiconductor subsidiary, plans to hold an IPO in Hong Kong in 2027, aiming to raise at least US$2 billion to US$3 billion. If the report is accurate, this would become one of the largest semiconductor IPOs in the Hong Kong stock market in recent years. Sina Tech sought confirmation from Alibaba's official channels regarding the matter, but had received no response as of publication. Public information shows that T-Head was established in 2018, formed through the integration of C-SKY Microsystems, which Alibaba acquired, and the DAMO Academy chip team, carrying Alibaba's full-stack ambitions in the semiconductor field from "making chips" to "using chips." Since its establishment, its product line has covered the XuanTie series processors, Yitian server chips, Hanguang AI chips, Yuzhen RFID chips, Zhenyue 510 enterprise-grade SSD controller chips, and PPU chips, and it also possesses the "Wujian" SoC chip design platform. Alibaba CEO Eddie Wu disclosed on the Q3 fiscal year 2026 earnings call that T-Head "has already been successfully commercialized," with chip volume exceeding 470,000 units and annualized revenue exceeding the RMB 10 billion level.