AI computing power demand overwhelms advanced packaging capacity! TSMC (TSM.US) reportedly plans to raise prices by 10-20%, putting cost pressure on Nvidia and Apple.

Zhitong Finance APP has learned that, according to supply chain sources, TSMC (TSM.US) is preparing to raise prices for advanced packaging processes by 10%20%, as surging AI chip demand is squeezing capacity. If this plan is implemented, the costs of chip manufacturers such as Nvidia (NVDA.US) and AMD (AMD.US) will be pushed higher, and Apple's (AAPL.US) iPhone and MacBook may also face a new round of price increase pressureprices for these two product lines have already been raised earlier due to rising memory chip prices.