The Semiconductor Packaging and Testing Annual Conference will be held from November 4 to 6, with multiple listed companies participating.

The reporter learned that the 24th China Semiconductor Packaging and Testing Technology and Market Annual Conference will be held from November 4 to 6 at the Nanjing Fengda International Hotel. During the two-day conference, leading enterprises in fields such as semiconductor packaging and testing, chip design, glass substrates, and advanced packaging and testing equipmentincluding Huatian Technology, JCET, Tongfu Microelectronics, TSMC Nanjing, Biren Technology, BOE, and Yuntian Semiconductorwill exchange views on the latest development directions of advanced packaging through the main forum, thematic reports, and supply-demand matchmaking, among other formats.