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There are reports that NVIDIA has asked Samsung Electronics, SK Hynix, and Micron Technology to use base dies manufactured with TSMC's 3nm process to produce NVHBM (NVIDIA's custom HBM technology; HBM refers to high-bandwidth memory), while the core dies will use sixth-generation DRAM (dynamic random-access memory) technology. Samsung Electronics has decided to accept NVIDIA's technical requirements. Regarding the authenticity of this matter, on October 19, Samsung Electronics responded that the company does not comment on matters involving customers.
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