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According to a Sunday report by the Seoul Economic Daily, Samsung Electronics will adopt TSMC's 3nm process to produce base dies for Nvidia's next-generation custom HBM chips. The move would mark the first time Samsung has collaborated with TSMC in the HBM manufacturing stage. The newspaper, citing industry sources, said Nvidia has asked Samsung, SK Hynix, and Micron Technology to use TSMC's process to manufacture NVHBM base dies and to use sixth-generation DRAM technology to manufacture their core chips. According to the company, NVHBM, released in August this year, integrates Nvidia's custom memory controller into the base die, aiming to achieve standardized implementation across multiple memory suppliers. According to the Seoul Economic Daily, Samsung accepted Nvidia's request after internal evaluation but plans to continue using its own production model to produce standard HBM and custom products for other customers. The newspaper, citing sources, said Samsung is also evaluating whether its own foundry would be able to produce NVHBM base dies if demand exceeds TSMC's capacity.