BOE A: 24-layer glass-based packaging substrates have been produced and samples delivered.

BOE A stated during an investor relations activity that the company has now achieved full-process integration for glass-based packaging substrates, including high-aspect-ratio TGV drilling, deep-hole copper filling, low-stress metal wiring, high-layer-count lamination, high-density wiring, and low-stress cutting, and possesses complete glass-based packaging substrate manufacturing process capabilities. At present, the company's pilot line has achieved full automation equipment line connection, and glass-based packaging substrates of over 100100mm in size with 24 layers (11-2-11) have been produced and sent for sampling, and have now passed multiple reliability standard tests.