Dongxin Co., Ltd.: The company's computing-storage-memory fusion chip R&D project is planned to have a cycle of approximately 42 months.

September 30 news: Dongxin Co., Ltd. released the record of investor relations activities announcement. The company's storage-computing-link fusion chip R&D project has a planned cycle of about 42 months, and the project is progressing in an orderly manner. The project integrates storage, connectivity, and computing units into a single chip through advanced packaging to create a low-power embedded intelligent computing chip, featuring local intelligent processing, data privacy and security, low latency, and low power consumption, and is developed by the company's own team. The chip needs to go through multiple stages such as architecture design, tape-out, software and hardware debugging, and customer verification, and there is uncertainty in the R&D implementation. For specific progress, please refer to the information disclosed by the company.