Lates News

According to the latest semiconductor advanced packaging industry research by TrendForce, as GPU manufacturers and hyperscale cloud service providers (CSPs) continue to develop more powerful and functionally diverse AI chips, one development focus of 2.5D packaging technology lies in expanding packaging area. Among these, TSMC's CoWoS-L, despite facing competition from Intel's EMIB-T, is expected to remain the mainstream packaging solution for AI chips through 2028, thanks to its technological maturity and yield advantages.