Huawei releases the world's first 3D data center.

Huawei today released the world's first 3D data center, published the monograph "3D Data Center," and opened the "3D Data Center Conceptual Design Gallery." The 3D data center draws on the concept of strict separation between the "power layer" and the "production layer" in chip factories, vertically stacking the various functional spaces that are horizontally deployed in traditional data centers to form a four-layer architecture from bottom to top: the cooling layer, IT equipment layer, power supply layer, and backup power layer. Wang Tao, Huawei's Deputy Chairman and Rotating Chairman, said that trillion-parameter large models and rapidly growing Token demand have placed higher demands on AI infrastructure, and Ascend supernode clusters of more than 100,000 cards will become a basic configuration. The 3D data center supports the Ascend supernode cluster's supercomputing factory through layered decoupling and three-dimensional stacking.