Report: Samsung Electronics adjusts custom HBM base chip supply chain, may pursue a "dual-track" strategy.

According to industry insiders, in the era of customized high-bandwidth memory, Samsung Electronics' strategy of providing base chips for its high-bandwidth memory is expected to undergo significant changes. The company will no longer rely on its existing in-house foundry for independent production, but instead adopt a "dual-track process" strategy, simultaneously using base chips based on TSMC's process. Starting with the mass production of HBM4 this year, Samsung Electronics and SK Hynix have begun using foundry processes rather than traditional DRAM processes to manufacture base dies. Compared with DRAM processes, the advantage of foundry processes lies in the ability to integrate more functions into the base die, thereby improving performance and energy efficiency.