Storage and Logic Chip Iterative Upgrades: The CMP Market Welcomes a New Opportunity

As the semi-annual reports are gradually released, the performance of domestic CMP companies, represented by Dinglong Co., Ltd., has attracted attention. The listing of Changxin Technology has further boosted confidence in the transformation of the storage chip technology route. CMP, as one of the key processes in integrated circuit manufacturing, is standing at the forefront of new opportunities. According to reporters' investigations, the evolution of wafer manufacturing towards high density and three-dimensionality has directly driven the polishing steps and the frequency of consumable replacements, leading to a significant release of market elasticity for CMP materials. Driven by the dual forces of increasing demand in the domestic supply chain and the wave of domestic substitutions, this critical process is ushering in unprecedented development opportunities.