TCL Technology: Renaming of 2 Billion Yuan Corporate Bonds

TCL Technology announced that the company previously received approval from the China Securities Regulatory Commission to issue corporate bonds not exceeding 10 billion yuan. This time, it plans to issue bonds with a scale not exceeding 2 billion yuan. The original name "TCL Technology Group Co., Ltd. 2025 Public Offering of Corporate Bonds for Professional Investors" has now been changed to "TCL Technology Group Co., Ltd. 2026 Public Offering of Technology Innovation Corporate Bonds for Professional Investors." This change in the bond's name does not alter the validity of the original legal documents related to the issuance, and the previously signed legal documents remain effective for the renamed bonds.