China National Building Material (03323.HK) plans to issue no more than 2 billion yuan of corporate bonds for technological innovation.

Zhituo Finance APP News: China National Building Material Company Limited (03323.HK) issued an announcement stating that it will publicly issue the Technology Innovation Corporate Bonds (the fifth phase) for professional investors in 2026 (hereinafter referred to as this bond). This is the seventh issuance of this bond, with a total scale not exceeding 2 billion yuan (including 2 billion yuan). This bond is intended for public issuance to professional institutional investors and is expected to be listed on the Shanghai Stock Exchange. The bonds of variety one are referred to as Jian Cai K25, with the bond code 245903.SH; the bonds of variety two are referred to as Jian Cai K26, with the bond code 245904.SH.