CICC: Demand for high-end photoresist dry film is expanding, possessing long-term investment value.

According to a research report from China International Capital Corporation, the PCB industry in China has accelerated its development in recent years, providing opportunities for domestic enterprises to develop the dry film manufacturing industry. The technical barriers for dry film are high, and with continuing growth in demand, it has long-term investment value. It is estimated that the market size of the photosensitive dry film will reach approximately $2.333 billion by 2026, and it is expected to reach $3.348 billion by 2030, with a CAGR of 9.44%. According to Prismark data, the global PCB market size will reach $85.8 billion by 2025, a year-on-year increase of 16.7%; this year it is expected to reach $102 billion, a year-on-year increase of 19%. Prismark anticipates that the market size will be approximately $144.6 billion by 2030. The AI sector is growing rapidly, with a swift increase in demand for high-level PCBs such as multilayer boards/HDI/packaging substrates. We expect that by 2030, the corresponding dry film market size for multilayer boards/HDI/packaging substrates will increase by 45.2%/50.6%/54.4%, respectively, compared to 2026.