Jiao Cheng Ultrasound: Advanced ultrasonic scanning microscopy has officially received orders from leading domestic storage manufacturers.

Regarding breakthroughs in the semiconductor field, JIAOCHENG Ultrasonics introduced in the research summary released today that in the power semiconductor sector, the company offers a full-process ultrasonic solution including ultrasonic terminal welding machines, ultrasonic PIN pin welding machines, ultrasonic bonders, and ultrasonic scanning microscopes, all of which have begun mass shipments. In the field of advanced semiconductor packaging, the companys advanced ultrasonic scanning microscopes can be applied for product inspections in semiconductor wafer-level packaging, 2.5D/3D packaging, and panel-level packaging, successfully securing formal orders from leading domestic semiconductor memory manufacturers; the ultrasonic die-bonding machine has also received formal orders from customers, with product validation progressing smoothly. The company continues to closely follow the upgrading demands and technological development trends of the downstream semiconductor industry, continuously enhancing its product matrix, deepening cooperation with downstream customers, and promoting the sustainable development of its semiconductor business.