Lates News

According to the Seoul Economic Daily, AMD CEO Lisa Su stated that negotiations with Samsung Electronics on the formal contract for mass supply of HBM4 are "close to completion." In March of this year, the two companies signed a cooperation memorandum, which includes Samsung prioritizing the supply of HBM4 to AMD's new generation AI accelerators and advancing wafer fabrication cooperation. Su made the announcement at the "AMD Advancing AI 2026" event, saying that the AI server rack system, Helios, has entered full production and is expected to start shipping from the end of the third quarter. With the production of Helios, AMD is discussing further expanding the specific contract for HBM4 supply with Samsung. Han Jin-man, head of Samsung Electronics' semiconductor foundry business, and Cho Sang-yeon, head of the Americas semiconductor business, attended the event and continued discussions with AMD CTO Joseph Macri and other executives after the speeches. The two Samsung executives stated that an important meeting will take place soon but did not specifically address the issue of the follow-up contract for HBM4. When asked about the possibility of continued supply of HBM and AMD chips being manufactured by Samsung, Macri only said that the two sides maintain a "cooperative relationship."