SiLang Technology showcases its self-developed "Sky" 3D science computing device, ultra-intelligent integrated platform, and other products at the World Artificial Intelligence Conference.

The World Artificial Intelligence Conference 2026 will be held in Shanghai from July 17th to July 20th. S-Link Technology will showcase its self-developed "Sky" 3D scientific computer, ultra-intelligent integration platform, and UCP series communication baseband chips at the exhibition area. Compared to traditional supercomputing and intelligent computing centers, the core value of "Sky" lies in its tailored customization for AI4S. Leveraging the computing power advantages of the "Sky" 3D scientific computer, the company is deeply involved in the construction of the "Ultra-Intelligent Integrated Computing Platform" at the Shanghai Artificial Intelligence Laboratory, promoting the synergy of scientific computing and intelligent computing resources, data interchange, and model sharing.