Broadcom and Wistron to establish a joint venture company for advanced panel-level packaging.

Leading chip testing company Li Cheng announced today that they will jointly establish a joint venture company with Broadcom in Singapore to manufacture advanced packaging at the panel level, with a total expected investment of $400 million. The investment will be gradually increased depending on the progress of setting up the factory in Singapore and the funding requirements. The main purpose of establishing the joint venture company is to complement the overall international layout strategy, and to closely meet the supply chain needs of global customers, enhancing advanced packaging manufacturing capabilities.