Lates News

The Commercial Times reported in a blog post today (July 9th) that Nvidia's next-generation Rosa CPU is expected to adopt TSMC's A16 process and be equipped with backside power delivery technology. Compared to TSMC's N2P process, the A16 process can increase chip density by up to 1.1 times. The key change is the introduction of Super Power Rail backside power delivery technology, which moves the power network to the backside of the wafer, thereby improving power efficiency, reducing IR drop, and freeing up front-side wiring space for signal interconnection.