Lates News

date
03/07/2026
According to industry sources, on July 1st, the world's top semiconductor packaging and testing (OSAT) supplier, ChipMOS Technologies, announced another price hike, with the highest price increase exceeding 20%. ChipMOS Technologies' price hike this time covers various advanced packaging technologies, including chip-on-wafer substrate (CoWoS) and fan-out wafer-level chip scale packaging (FoCoS).
Latest
See all latestmore