Lates News
According to industry sources, on July 1st, the world's top semiconductor packaging and testing (OSAT) supplier, ChipMOS Technologies, announced another price hike, with the highest price increase exceeding 20%. ChipMOS Technologies' price hike this time covers various advanced packaging technologies, including chip-on-wafer substrate (CoWoS) and fan-out wafer-level chip scale packaging (FoCoS).
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