Jiangfeng Electronics: Adjusting the timeline for achieving the planned availability of the industrialization project for ultra-high purity metal sputtering target materials.

Jiangfeng Electronics announcement, the company's issuance of stocks to specific objects fundraising projects "Ningbo Jiangfeng Electronics annual production of 52,000 ultra-large-scale integrated circuit ultra-high purity metal sputtering target industrialization project", "annual production of 18,000 ultra-large-scale integrated circuit ultra-high purity metal sputtering target production line technical transformation project" and "Ningbo Jiangfeng Electronics Semiconductor Materials Research and Development Center construction project" to adjust the time to reach the pre-set usable state. The original plan was to reach the pre-set usable state on June 30, 2026, September 30, 2026, and June 30, 2026, respectively, and is now extended to December 31, 2027, April 30, 2028, and April 30, 2028, respectively.