Corning launches next-generation glass optical interconnection components.

Recently, at the AI Data Center Optical Communication and Interconnection Technology Conference held at POSCO Tower Yeoksam in Seoul, Corning officially launched the next generation glass optical interconnect component Glass Bridge. This product is based on glass waveguide technology, used to achieve direct optical connection between optical fiber and photonic integrated circuits, mainly targeting applications in co-packaged optics and glass substrate semiconductor packaging. The company stated that this solution constructs optical propagation paths within the glass to reduce the number of devices and alignment links in traditional optical interconnects, thereby enhancing optical interconnect density and system integration. Industry professionals told reporters that Corning's Glass Bridge optical interconnect component introduced this time is not a traditional plug-and-play optical module product, but rather focuses on a very basic but potentially crucial aspect in CPO packaging: how to connect optical fibers to photon chips with low loss, high density, and mass production capability. This may indicate that the next round of competition in AI optical communication is moving towards glass substrates, optical coupling, fiber-to-PIC connections, and CPO packaging interfaces.