Dinglong Corporation's polishing pad products have obtained customer orders from the board-level packaging industry and will be entering mass production for use on board-level packaging production lines, with glass substrates as the main representative.

According to Dinglong's message, recently, Dinglong successfully obtained an important customer order in the field of board-level packaging for its polishing pad products, which will be mass-produced and used in board-level packaging production lines represented by glass substrates. This order is another breakthrough for Dinglong's polishing pad products in the field of advanced packaging. After entering 2.5D and 3D packaging production lines, it has successfully entered the board-level packaging field.