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Lates News

11/06/2026

The non-ferrous sector fluctuated and rose, with multiple stocks such as Xianglu Tungsten Industry, Jinmolybdenum Shares, East Tantalum Industry, Guiyan Platinum Industry, and Shenglong Shares hitting the daily limit up. Zhangyuan Tungsten Industry, Zhongtung High-Tech, and Xiamen Tungsten Industry rose by more than 7%.

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1 m ago

Shengquan Group established a new material technology company in Xinjiang.

2 m ago

Guo Mingqi: CoPoS is expected to start mass production in the second half of 2028, and glass and ABF are not interchangeable.

3 m ago

Analyst Guo Mingchi wrote that TSMC's next generation of advanced packaging technology, CoPoS, is expected to begin mass production in the second half of 2028. Research shows that glass material will not replace ABF thin film chip interconnection function, as the interconnect function of chips is focused on the wiring layer (RDL) on the chip side, glass via holes/copper interconnect structures within the glass substrate, and ABF layers working together. Therefore, glass and ABF thin film are complementary and do not have a replacement relationship.

4 m ago

Dollar Bond Movement | China Petrochemical (SINOPEC) 5.375% 10/17/43 price dropped by 1.408% to 102.779.

4 m ago

Movement in USD Bond|China Evergrande EVERRE 12 01/22/24 price dropped by 2.752% to 2.145.

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