Dinglong shares (300054.SZ): The holding subsidiary independently developed abrasives formally enters the third-generation semiconductor market.

Wisdom Financial News APP, Dinglong shares (300054.SZ) announced that its controlling subsidiary, Wuhan Dingze New Material Technology Co., Ltd. (referred to as "Dingze New Material"), has recently made breakthrough progress in the field of semiconductor CMP polishing slurry: (1) its core product won the best supplier award from a leading wafer factory customer; (2) its copper barrier layer polishing slurry has received new customer batch orders; (3) its silicon carbide (SiC) substrate polishing slurry has successfully landed batch orders, and the core raw material of the polishing slurry- self-developed abrasives has officially entered the third-generation semiconductor market.