Dinglong Group: Significant Progress in CMP Polishing Slurry Products

Dinglong Co., Ltd. announced that its controlling subsidiary, Dingze New Materials, has made breakthrough progress in the field of semiconductor CMP polishing liquid. Its core products have won the Excellent Supplier Award from top wafer factories. The copper barrier polishing liquid has received bulk orders from new customers, and the silicon carbide substrate polishing liquid has also secured bulk orders. The polishing liquid, which carries alumina abrasive particles and is used in the copper process, is the mainstream in the market, with the total domestic market size expected to exceed 4 billion RMB by 2026. The company has achieved a full range layout of CMP polishing liquid, with sufficient production capacity reserves. In the future, the company will focus on the high-end materials track to ensure performance growth.