Samsung's Lee Jae-yong is rumored to be meeting with Mediatek's Cai Li Xing to try to secure the contract for manufacturing the Dimensity chips.

According to reports, Samsung chairman Lee Jae-yong will meet with MediaTek CEO Cai LiXing to discuss potential future cooperation, attempting to win MediaTek's business from TSMC and become a Samsung wafer foundry customer. In order to increase the likelihood of cooperation, Samsung may offer MediaTek priority supply conditions for the memory needed for future Dimensity series smartphone chips, as an important bargaining chip to attract MediaTek's business.