Delong Laser: SDBG, a wafer laser dicing equipment developed for the storage chip direction, has achieved a breakthrough order.

Delong Laser stated on the interactive platform that the company has developed wafer laser dicing equipment, wafer laser grooving equipment, laser marking equipment and other products for the storage chip direction. Among them, the wafer laser dicing equipment has achieved a breakthrough order, while other products are still in the verification stage. The expansion of storage chip production will drive the demand growth for related equipment. At present, the order amount in this field is relatively small, so please pay attention to investment risks.