Yinweike: The global liquid cooling penetration rate is already high by 2025, but domestically it is relatively lagging behind.

On April 21st, Yiwei Ke stated at an analyst conference that the global penetration rate of liquid cooling is already high by 2025, but it is still relatively lagging behind domestically. With the dual drive of the high heat density trend and high energy efficiency heat dissipation requirements in computing equipment and data center machine rooms, liquid cooling technology is being rapidly adopted. Yiwei Ke's cold plate products not only adapt to the heat dissipation of CPU, GPU, computing ASIC chips, and exchange ASIC chips, but also begin to match other heat sources such as memory, SSD, optical modules inside servers or switch devices, effectively supporting the 100% liquid cooling requirements of related computing equipment. In the future, Yiwei Ke will continue to improve its technology and actively expand its domestic and foreign customer base.