Hong Kong Exchange's Cheung Wing-yee: "Connectivity Scheme" further increases the weighting of Chinese assets in the global market.

date
31/03/2026
Sina Finance reported on March 31 that at the ICMA China Debt Capital Market 2026 Annual Conference today, Shirley Cheung, Senior Vice President of Fixed Income and Currency Products Development at the Hong Kong Stock Exchange, said that in order to facilitate offshore investors in managing risks, the Hong Kong Stock Exchange, together with the China Foreign Exchange Trading System and Shanghai Clearing House, are jointly operating the "Bond Connect" program, continually simplifying entry procedures and lowering investor concerns. Currently, the trading volume of "Bond Connect" is growing steadily, with hundreds of domestic and foreign institutions participating. "Bond Connect" helps to further increase the weight of Chinese assets in the global market and enhance the attractiveness of the Chinese market to overseas investors.