Shenzhen: Accelerating applications such as special printed circuit boards, FCBGA/BT packaging substrates.

The Industrial and Information Technology Bureau of Shenzhen recently issued the "Action Plan for Accelerating the High-Quality Development of the Artificial Intelligence Server Industry Chain in Shenzhen", proposing to leverage the advantage of Shenzhen as a global PCB manufacturing core base to focus on the development of AI servers using multi-layer high-order high-speed boards, rigid-flex combination boards, flexible boards, advanced packaging substrates, 6th-order and above ultra-high-order HDI boards, and ABF carrier boards, promoting the large-scale application of cutting-edge low-dielectric high-end base materials; strengthening the research and development and capacity layout of high-order carrier boards and flexible circuit boards, expanding the capabilities of small-scale and diversified custom PCB services, and providing support for enterprise research and pilot production. Accelerating the application of special printed circuit boards, FCBGA/BT packaging substrates, etc., supporting the efficient interconnection of data centers and backbone networks.