Zhenyou Technology: plans to issue no more than 500 million yuan of technology innovation bonds.

Shin You Technology announced on March 24th that in order to implement the company's innovation-driven development strategy, increase investment in scientific and technological innovation, and further expand financing channels and optimize debt structure, the company plans to apply to the China Central Depository & Clearing Co., Ltd. for the registration and issuance of technology innovation bonds with a total amount not exceeding 500 million yuan.