The innovative bond market remains hot, with the issuance scale exceeding 180 billion yuan this year.

Since the beginning of this year, the scale of issuance of science and technology innovation bonds has grown significantly, remaining active and becoming an important tool in the bond market to serve technological innovation and do a great deal in "technology finance." According to Wind data, as of March 23rd, based on the listing date as the benchmark, a total of 212 science and technology innovation bonds have been issued in the market, with a total issuance scale of 181.86 billion yuan, representing a year-on-year increase of 78% and 60% respectively.