The first "AI + humanoid robot" research and development field science and technology innovation bond issuance nationwide.

In February 2026, Junpu Intelligent issued the first phase of the 2026 Science and Technology Innovation Bonds in the interbank market (Bond Abbreviation: Junpu Intelligent MTN001). This is the first "AI+ humanoid robot" research and development field innovation bond in the country, and also the first innovation bond issued by a science and technology board listed company in Zhejiang Province this year. Junpu Intelligent's Science and Technology Innovation Bonds have a issuance size of 200 million yuan, a term of 2 years, a AAA bond rating, a coupon rate of 2.49%, and the funds raised will be used entirely for the research and development of core technologies for AI+ humanoid robots, upgrading of intelligent manufacturing equipment, and repayment of existing debts, in order to reduce the company's overall cost of funds.