SK Hynix is developing new technologies to reduce NAND manufacturing costs.

According to reports, SK Hynix is developing an innovative technology called "AIP" to alleviate the cost increases that come with increasing the number of stacked layers. It is said that traditional manufacturing methods require etching multiple NAND layers separately and connecting them through bonding processes, while AIP aims to significantly reduce manufacturing costs by etching all NAND layers at once.