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Home > Latest

Samsung Electronics' HBM4E base chip has entered the backend design stage.

date
07/02/2026
Samsung Electronics is currently developing the base chip for the seventh generation high-bandwidth memory, which has entered the back-end design stage. In addition, the company has recently established a new HBM roadmap with the goal of accelerating the production of HBM4, HBM4E, and HBM5 products.
Latest
4 m ago
Shanghai Municipal Commission of Economy and Informatization: In Shanghai, there is no shortage of computing power for good models, no shortage of language data for good applications, and no shortage of chips for good products.
26 m ago
Hai Chen Energy Storage 6.25MWh system passed large-scale fire testing.
27 m ago
Multiple listed companies are laying out immersion liquid cooling, and the advantages of the fluorosilicon whole industry chain are highlighted.
27 m ago
Stellantis: Note the decision to cancel the Germany and Italy super factory project by ACC.
32 m ago
Regulatory authorities: This year, Beijing will focus on cracking down on monopolistic behavior in the platform economy sector.
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