Chongda Technology: Subsidiary plans to invest 1 billion yuan to build the functional IC packaging carrier project at the end side.

Chongda Technology announced that on January 22, 2026, the sixth meeting of the Board of Directors of the company approved relevant resolutions, and the holding subsidiary, Pu Nuowei, signed an investment agreement with the People's Government of Qiandeng Town, Kunshan, to invest in the "End-side Functional IC Packaging Substrate Project." The project is located in Qiandeng Town, Kunshan, Jiangsu, with a total investment of 1 billion yuan, funded by self-owned and self-raised funds. The project is scheduled to have the land listed in May 2026, start construction in September, and be completed and put into operation in September 2028. This investment does not constitute a related party transaction or a major asset restructuring, but faces risks such as approval, implementation, market, and funding.