Fudan team publishes article in top journal: developed "fiber chip" that can be woven into fabric like regular yarn.

In the early hours of January 22nd, the leading international academic journal "Nature" published the latest research results of the team led by Peng Huisheng and Chen Peining from Fudan University, titled "Fiber Integrated Circuits based on Multilayer Spiral Architecture". The team successfully manufactured large-scale integrated circuits within flexible polymer fibers, creating the world's first "fiber chip". This means that for the first time, "chips" have moved from "hard blocks" to "soft fibers", providing new technological support for future industries such as smart textiles, brain-machine interfaces, virtual reality, and more.