TSMC increases investment in advanced packaging, as Apple's A20 chip may adopt WMCM technology.

TSMC continues to increase investments in advanced packaging technology. As Apple transitions to 2nm process technology for the A20 series chips in the iPhone 18, they also plan to upgrade packaging technology from the current InFO process to WMCM packaging. It is reported that TSMC is constructing a new WMCM production line at its AP7 factory in Chiayi.